FTD provides optimized test solutions for high-current product testing, and can provide a variety of customized sockets for QFN, QFP and BGA chips. It is suitable for various test methods such as manual test, machine test and aging test.

●  FTD optimized design for high current products 

●  QFN，QFP，SO multiple packages 

●  >0.4mm lead pitch  

●  *Kelvin test design

●  Excellent contact reistance and current capability 

●  Three temperature test capability（-55°C-150°C）

●  Lead package: QFP, SO, others –400 µm pitch and up

●  Leadless package: QFN, others – 400 µm pitch and up

●  Lead pitch： >0.4mm                      

●  Pin force： 35g -80g                    

●  Test travel：0.4mm -0.85mm

●  Pin life：1KK-1.5KK                 

●  Socket Life： >5KK               

●  Clean frequency：100K-300K

●  Socket material： Vespel SP-1, Plavis– N, MDS-100, and Peek ceramic

●  Spring pin material: Cu coated Gold

●  Contact resistance：30mΩ

●  Current capacity：12A 持续电流

●  Current capacity：150A瞬时电流@1% duty cycle

●  Bandwidth： > 2.5GHZ @-1db

●  Inductance： 2.2nH

●  Temperature range： -55°C - 175°C