Thermal analysis
The hot simulation team provides socket (test socket) or wafer to package, package to test socket, test socket to test carrier board and other system and simulation services.
High power heat pipe
Water-cooling
Ordinary fins
Force analysis
The force simulation team has the ability to provide simulation services and capabilities for socket (test socket) or chip packaging, test carrier board and other peripheral supporting applications.
Chip deformation
Socket loading PCB deformation
Socket deformation
Electromagnetic analysis
The Radio Frequency Simulation (SI/PI) team provides socket (test socket) simulation or system level simulation services from chip packaging, socket (test socket) to test carrier board through simulation software, and adjusts the corresponding structure based on simulation results to optimize the performance of link RF and signal integrity testing.
Socket value - eye diagram analysis
Socket field distribution
