Significant contact resistance stability and long production life
Self-developed process,simple design and low cost
Applicable to all package type
Excellent high frequency performance
Suitable for manual test,mechine test and burn-in test
FTD self-design to provide the best test performance | WLCSP,BGA,QFN,QFP multiple packages |
＞0.25mm lead pitch | Total metal housing |
50Ω Impedance matching,excellent high frequency and high speed performance(80Ghz/224Gbps) | Three temperature test capability(-55℃-175℃) |
Ball array packages:BGA,LGA,WLCSP,others-250 μm pitch and up
Lead package:QFP,SO,others-250 μm pitch and up
leadless package:QFN,others-250 μm pitch and up
Socket material: Metal
Spring pin material:Gold,PD
Lead Pitch:0.25mm and above
Pin Fore:15g-40g
Test Travel:0.3mm-0.65mm
Pin Life:300K-800K
Socket Life Time:>5KK
Clean Frequeny: 50K-100K
Contact resistance: 80mΩ
Current capacity: 3.5A continuous current
Bandwidth:>80GHz@-1db
Inductance:1.0nH
Temperature range:-55℃-175℃