Standard family design and best test performance | WLCSP,BGA,QFN,QFP multiple packages |
0.35mm lead pitch | Optimized positioning frame design |
Excellcent contact resistance and current capability | Three temperature test capability (-55℃-150℃) |
Significant contact resistance stability and long life.
Standardized family design,simple and durable,best performance and low cost.
Multiple packages design.
Design for manual test, machine and burn-in test.
Shortest design and production service time.
Standard family design and best test performance | WLCSP,BGA,QFN,QFP multiple packages |
0.35mm lead pitch | Optimized positioning frame design |
Excellcent contact resistance and current capability | Three temperature test capability (-55℃-150℃) |
Ball array packages:BGA,LGA,WLCSP,others-350 μm pitch and up
Lead package:QFR,SO,others-350 μm pitch and up
leadless package:QFN,others-350 μm pitch and up
Socket material: Vespel SP-1,Plavis-N,MDS-100,and Peek ceramic and others
Spring pin material:Gold,PD
Lead pitch:>0.35mm
Pn force:15g-40g
Test travel:0.3mm-0.65mm
Pin life: 500K-1KK
Socket life:>5KK
Clean frequency:50K-100K
Contact resistance: 50mΩ
Current capacity: 5A continuous current
Bandwidth:>20GHZ@-1db
Inductance:1.2nH
