Excellent resistance stability and long production life time
Optimized simple design and cost effective
Suitable for various sensor applitcations
Suitable for manual test,machine test and burn-in test
FTD optimized design to provide the best test performance | Multiple MEMS sensor application(pressure,magnetic,CMOS） |
0.3mm lead pitch,16 sites test | Optimized positioning frame design |
Excellent contact resistance and current capability | Three temperature test capability(-55℃-150℃) |
Ball array packages:BGA,LGA,WLCSP,others-350 μm pitch and up
Lead package:QFR,SO,others-350 μm pitch and up
leadless package:QFN,others-350 μm pitch and up
Socket material: Vespel SP-1,Plavis-N,MDS-100,and Peek ceramic
Spring pin material:Gold,PD
Lead pitch:>0.3mm
Pin force:15g-40g
Test travel:0.3mm-0.65mm
Pin life: 500K
Socket life:>5KK
Clean frequency:50K-100K
Contact resistance: 50mΩ
Current capacity: 2.5A continuous current
Bandwidth:>30GHZ@-1db
Inductance:1.0nH
Temperature range:-55℃-150℃