FTP optimized design for high current products | QFN,QFP,SO multiple packages |
＞0.4mm lead pitch | Kelvin test design |
Excellcent contact resistance and current capability | Three temperature test capability (-55℃-150℃) |
Significant high current capacity and long production life time.
Standard design is simple and low cost.
Applicable QFN,QFP,SO packages.
Suitable for manual test, machine test and burn-in test.
Shortest design and production leadtime.
FTP optimized design for high current products | QFN,QFP,SO multiple packages |
＞0.4mm lead pitch | Kelvin test design |
Excellcent contact resistance and current capability | Three temperature test capability (-55℃-150℃) |
Ball array packages:QFR,SO,others-400 μm pitch and up
Leadless package:QFN,others-400 μm pitch and up
Socket material: Vespel SP-1,Plavis-N,MDS-100,and Peek ceramic
Spring pin material:Cu coated Gold
Lead pitch:0.4mm above
Pin force:35g-80g
Test travel:0.4mm-0.85mm
Pin life: 1KK-1.5KK
Socket life:>5KK
Clean frequency:100K-300K
Contact resistance: 30mΩ
Current capacity: 12A continuous current
Current capacity: 150A peak current@1% duty cycle
Bandwidth:>2.5GHZ@-1db
Inductance:2.2nH
