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High Power Socket

High current,high voltage test chip socket solution.

Product Advantages

  • Significant high current capacity and long production life time.

  • Standard design is simple and low cost. 

  • Applicable QFN,QFP,SO packages. 

  • Suitable for manual test, machine test and burn-in test.

  • Shortest design and production leadtime.

大功率测试插座



FTP optimized design for high current products
QFN,QFP,SO multiple packages 
>0.4mm lead pitch
Kelvin test design
Excellcent contact resistance and current capability
Three temperature test capability (-55℃-150℃)

Package Type

Ball array packages:QFR,SO,others-400 μm pitch and up 

Leadless package:QFN,others-400 μm pitch and up

Material

Socket material: Vespel SP-1,Plavis-N,MDS-100,and Peek ceramic

Spring pin material:Cu coated Gold

Mechanical

Lead pitch:0.4mm above

Pin force:35g-80g

Test travel:0.4mm-0.85mm

Reliability

Pin life: 1KK-1.5KK  

Socket life:>5KK  

Clean frequency:100K-300K

Electrical

Contact resistance: 30mΩ  

Current capacity: 12A continuous current

Current capacity: 150A peak current@1% duty cycle

Bandwidth:>2.5GHZ@-1db

Inductance:2.2nH

Environmental

Temperature range:-55℃-150℃

+86-0512-6957-2000

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