Short contact lenght<1.3mm which have excellent RF peformance | QFN,QFP,SO mutiple packeges |
＞0.35mm lead pitch | Kelvin test design |
Excellent contact resisitance and current capability | Three temperature test capability(-55℃-150℃) |
Excellent High-frequeney performance for Analog,RF&5G product.
Short contact lenght design.
Applicable QFN,QFP,SO packages.
Suitable for manual test,mechine test.
Self cleaning design and long life time.
Short contact lenght<1.3mm which have excellent RF peformance | QFN,QFP,SO mutiple packeges |
＞0.35mm lead pitch | Kelvin test design |
Excellent contact resisitance and current capability | Three temperature test capability(-55℃-150℃) |
Ball array packages:QFP,SO,others-400 μm pitch and up
Leadless package:QFP,SO,others-400 μm pitch and up
Socket material: Vespel SP-1,Plavis-N,MDS-100
Spring pin material:Cu coated Gold
Lead Pitch:0.4mm
Pin Fore:25g-50g
Test Travel:0.25mm-0.35mm
Pin Life:500K-1KK
Socket Life Time:>3KK
Clean Frequeny: 100K-300K
Contact resistance: 50mΩ
Current capacity: 2A continuous current
Bandwidth:>16.5GHZ@-1db
Inductance:0.35nH
Temperature range:-55℃-150℃