FTDevice providing professional test interface products in High Frequency RF Area. An internally developed product is a conductive socket material which is selectively insulated with an exceptionally tough coating. This permits single ended bandwidths as high as 40 GHz and digital data rates of as much as 26 Gbps.

●  FTD self-design to provide the best test performance 

●  WLCSP，BGA，QFN，QFP multiple packages    

●  >0.65mm lead pitch 

●  Total metal housing 

●  50Ω Impedance matching，excellent high frequency and high speed performance（45Ghz/28Gbps) 

●  Three temperature test capability（-55°C-150°C）

●  Ball aray packages：BGA, LGA, WLCSP, others – 350 µm pitch and up

●  Lead package： QFP, SO, others – 350 µm pitch and up

●  Leadless package： QFN, others – 350 µm pitch and up

●  Lead pitch： >0.65mm 

●  Pin force： 15g -40g

●  Test travel：0.3mm -0.65mm

●Pin life：300K-800K                     

●Socket Life： >5KK                 

●Clean frequency：50K-100K

●  Socket material： Metal

●  Spring pin material: Gold PD

●  Contact resistance：80mΩ

●  Current capacity：2.5A continous current 

●  Bandwidth： > 50GHZ @-1db

●  Inductance： 1.0nH

●  Temperature range： -55°C - 150°C