Burn-in Socket

Low Cost ,High reliability burn-in test socket

Burn-In Socket:

28 family Size 28x38mm

3S family Size 38x48mm

55 family Size 55x65mm

Acceptable device:

0.35mm(19x19 contact max)

0.40mm(16x16 contact max)

0.50mm(10x10 contact max)

0.65mm(32x32 contact max)

BGA/QFN(LGA)

Introduce

Key Features Package type Mechanical Reliability Materials Electrical Environment

Introduce

FTD标准老化系列插座。采用注塑与加工相结合的结构，具有良好的使用寿命和可靠性同时又较低客户的采购成本。

Key Feature

-use pogo pin as testing method

-支持高频芯片测试

-很好的热传导性能与可靠性

-Excellent contact resistance and current capacity

Package type

● Ball aray packages：BGA, LGA, WLCSP, others – 350 µm pitch and up

● Lead package： QFP, SO, others – 350 µm pitch and up

● Leadless package： QFN, others – 350 µm pitch and up

Mechanical

● Lead pitch： >0.4mm

● Pin force： 15g -40g

● Test travel：0.3mm -0.65mm

Reliability

● Pin life：200K

● Socket Life： 5000h

● Clean frequency：50K

Materials

● socket material： MCP5000

● Pin plunger material： PD Alloy

● Spring Material： Steel

Electrical

● Contact resistance：100mΩ

● Current capacity：1.0A

● 介电强度能力 : AC100V rms 1 min

● 绝缘电阻能力 : 1000MΩ min

Environment

● Temperature range: -55°C - 150°C

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