0.2mm Pitch low cost and high performance WLCSP test socket
-Significant cost advantage compare with probe card
-Applicable for 0.2mm WLCSP package
-Suitable for manual test,machine test and all kind of testing method
FTD provides socket for wafer-level chip scale packages (WLCSP) in vertical probe applications. As a supplier, FTD provides a highly reliable, easily maintained, and very strong solution for this rapidly growing test industry.
-use pogo pin as testing method
-Support Kelvin test
-Excellent contact resistance and current capacity
● WLCSP package
● Package pitch： 0.2mm above
● Pin force： 15g -30g
● Test travel：0.5mm -0.85mm
● Pin life time：250K
● socket life time： >5KK
● Cleaning frequency：50K
● socket material： MCP5000
● Pin plunger material： PD Alloy
● Spring Material： Steel
● Contact resistance：80mΩ
● Current capacity：2.0A
● Temperature range： -55°C - 150°C
Phone：+86-0512-6957 2000
Fax：+86-0512-6957 3000
Mailbox：kevin@ftdevice.com
Address：No. 200 Xingpu Road, SIP Suzhou, Jiangsu P.R.C
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