FTD POP test sockets have been providing reliable solutions for both manual and automated testing of package-on-package devices. Our POP test sockets accurately align both top and bottom device pads. FTD has capability to design 0.4mm pitch POP socket with different electrical requirements.

Self-developed structure and simple design,long production life time.

> 0.4mm pitch 

3 temp testing (-55°C - 150°C）

●  POP package

●  Package pitch： > 0.4mm 

●  Pin Force： 15g -40g

●  Test travel：0.3mm -0.65mm

●  Pin life time：200K-500K                  

●  Socket life time： >5KK               

●  Cleaning frequency：50K-100K

●  socket material： PEI

●  Pin plunger material： PD Alloy

●  Spring material： Steel

●  Contact resistance：50mΩ

●  Current capacity：2.5A 

●  Band width： > 30GHZ @-1db

●  Temperature range： -55°C - 150°C